BSP16T1 transistor equivalent, pnp silicon high voltage transistor.
p to 30 degrees cooler than the adjacent solder joints.
STEP 5 STEP 6 STEP 7 STEP 4 HEATING VENT COOLING HEATING ZONES 3 & 6 ZONES 4 & 7 205° TO “SPIKE” “SOAK” 219°C 170°.
Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must .
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